Xiaomi Pad 8S Pro Clears 3C Certification, Debuts Brand-New In-House XRING O3 3nm Chip alongside MIX Fold 5

Two brand-new flagship Xiaomi tablets have passed China’s 3C regulatory certification, bearing model codes 2612CRPFFC with 67W charging and M367FC with 120W fast charging respectively. Industry insiders confirm both models sit in the high-end flagship bracket, with the 120W variant M367FC widely identified as the upcoming Xiaomi Pad 8S Pro.

Rumored hardware specs reveal the Pad 8S Pro packs a massive 12,000mAh battery, paired with a 12.5-inch 3.2K LCD display. Its camera layout consists of a 32MP front selfie lens and a dual rear camera setup combining a 50MP main sensor plus a 2MP depth auxiliary lens.

The tablet’s headline upgrade is its proprietary XRING O3 system-on-chip, co-launched alongside the Xiaomi MIX Fold 5 foldable smartphone at an August event. Manufactured on TSMC’s cutting-edge 3nm process, the engineering sample adopts a three-cluster CPU architecture: Prime ultra-large core clocked at 4.05GHz, Titanium performance core hitting 3.42GHz, and Little efficiency core running at 3.02GHz. Its integrated GPU tops out at 1.49GHz with a memory bandwidth of 9600MT/s.

This flagship slate will ship preloaded with the all-new HyperOS 4, where all native applications receive full AI integration to deliver an optimized intelligent interaction ecosystem.

The XRING series marks a major milestone for Xiaomi: the brand becomes China’s first and the world’s fourth tech firm capable of independent 3nm mobile chip R&D, following last year’s launch of the XRING O1 silicon. Xiaomi’s official roadmap confirms continuous iterative upgrades for its self-developed XRING lineup, ending the one-off fate of its earlier Pinecone chip project and pushing toward full domestic component integration across future Xiaomi flagships.